JEDEC tray is compatible with JEDEC tray feeder, reducing manual handling and loading and other processes, providing a complete automation service for efficient production, realizing automatic picking during assembly, avoiding damage to chips, and avoiding manual picking and chip oxidation.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.
Advantage:
1. Have exported for more than 12 years.
2. Have a professional engineer group and efficient management.
3. Delivery time is short, normally in stock.
4. A small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
7. The factory has an ISO certificate. The product complies with the RoHS standard.
Application:
Electronic component; Semiconductor Embedded System; Display technology; Micro and Nano systems; Sensor Test and Measurement Technology; Electromechanical equipment and systems; Power supply
Technical Parameters:
| Usage | Packaging of Electronic Components, Optical device, |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO, PPE, ABS, PEI, IDP, etc. |
| Color | Black, Red, Yellow, Green, White, and custom color |
| Size | Customized size, rectangle, circle shape |
| Mold type | Injection Mold |
| Design | Original sample, or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after the draft is confirmed and payment is arranged |
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated |
|
| Lead Time | 5-7 Working days |
| The exact time should be according to the ordered quantity |
Reference to the temperature resistance of different materials with the JEDEC Tray:
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized |
FAQ:
Q1: Are You a Manufacturer or a Trade Company?
We are a 100% Manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What is the material of your product?
ABS, PC, PPE, MPPO, PEI, HIPS, etc.
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirements.
Q4: How can I get the quotation for the custom products?
Let us know the size of your IC or component thickness, and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the free sample in stock can be sent, but the shipping fee should be paid by you.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send them right now if you are interested in something we have in stock, and customize the project depending on the specific time.
